Photoelectric conversion apparatus and imaging system

ABSTRACT

A photoelectric conversion apparatus includes a pulse shaping circuit that shapes an output from a diode of avalanche amplification type into a pulse, and a pulse conversion circuit that converts a pulse signal output from the pulse shaping circuit. The pulse conversion circuit converts a pulse signal having a first amplitude and output from the pulse shaping circuit into a pulse signal having a second amplitude smaller than the first amplitude.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of U.S. application Ser. No.17/015,729, filed Sep. 9, 2020, which is a Continuation of U.S.application Ser. No. 16/268,324, filed Feb. 5, 2019, now U.S. Pat. No.10,798,327, issued Oct. 6, 2020; which claims the benefit of JapanesePatent Application No. 2018-022023, filed Feb. 9, 2018, which is herebyincorporated by reference herein in its entirety.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a photoelectric conversion apparatusand an imaging system.

Description of the Related Art

There is known a photoelectric conversion apparatus that digitallycounts the number of photons having been reached a photodiode andoutputs a count value as a photoelectrically converted digital signalfrom a pixel. In terms of noise and signal arithmetic operationprocessing, the advantage of digitizing a pixel signal is large. UnitedStates Patent Application Publication No. 2015/0115131 discusses animaging apparatus in which a plurality of pixels each of which outputs aphotoelectrically converted digital signal is arrayed.

SUMMARY OF THE INVENTION

According to an aspect of the present invention, a photoelectricconversion apparatus includes a diode of avalanche amplification type, apulse shaping circuit configured to shape an output of the diode into apulse, a pulse conversion circuit configured to convert the pulse signalhaving a first amplitude into a pulse signal having a second amplitudethat is smaller than the first amplitude, and a signal processingcircuit configured to process the pulse signal having the secondamplitude output from the pulse conversion circuit, wherein the diode issupplied with a first power supply voltage and a second power supplyvoltage, wherein the signal processing circuit is supplied with a thirdpower supply voltage and a fourth power supply voltage, and wherein adifference between the first power supply voltage and the second powersupply voltage is greater than a difference between the third powersupply voltage and the fourth power supply voltage.

Further features of the present invention will become apparent from thefollowing description of embodiments with reference to the attacheddrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a configuration diagram illustrating a photoelectricconversion apparatus according to a first embodiment.

FIG. 2 is a diagram illustrating an equivalent circuit of thephotoelectric conversion apparatus according to the first embodiment.

FIG. 3 is a diagram illustrating an equivalent circuit of thephotoelectric conversion apparatus according to the first embodiment.

FIG. 4 is a cross-sectional diagram illustrating the photoelectricconversion apparatus according to the first embodiment.

FIG. 5 is a diagram illustrating a configuration of a photoelectricconversion apparatus according to a second embodiment.

FIG. 6 is a diagram illustrating a configuration of the photoelectricconversion apparatus according to the second embodiment.

FIG. 7 is a diagram illustrating a configuration of the photoelectricconversion apparatus according to the second embodiment.

FIG. 8 is a diagram illustrating an equivalent circuit of thephotoelectric conversion apparatus according to the second embodiment.

FIG. 9 is a cross-sectional diagram illustrating the photoelectricconversion apparatus according to the second embodiment.

FIG. 10 is a diagram illustrating a configuration of a photoelectricconversion apparatus according to a third embodiment.

FIG. 11 is a cross-sectional diagram illustrating the photoelectricconversion apparatus according to the third embodiment.

FIG. 12 is a diagram illustrating a configuration of a photoelectricconversion apparatus according to a fourth embodiment.

FIG. 13 is a cross-sectional diagram illustrating the photoelectricconversion apparatus according to the fourth embodiment.

FIG. 14 is a diagram illustrating a configuration of an imaging systemaccording to a fifth embodiment.

FIGS. 15A and 15B are diagrams illustrating a configuration of a movingbody according to a sixth embodiment.

DESCRIPTION OF THE EMBODIMENTS

In United States Patent Application Publication No. 2015/0115131, asubstrate for a photodiode unit and a substrate for a circuit unit areseparately provided in a layered structure, whereby a higher degree ofintegration and a higher speed of a photoelectric conversion apparatuscan be achieved. In the photoelectric conversion apparatus discussed inthe description of United States Patent Application Publication No.2015/0115131, high voltage power is used for the photodiode unit toutilize avalanche breakdown. Meanwhile, it is desirable to use lowvoltage power for the circuit unit, for a higher degree of integrationand a higher speed. The description of United States Patent ApplicationPublication No. 2015/0115131 however discusses nothing about an elementconfiguration in a case where a plurality of power supply voltages isused.

Embodiments to be described below relate to a technology for providing aconfiguration desirable for a photoelectric conversion apparatus thatincludes a photoelectric conversion unit for outputting a digital signaland uses a plurality of power supply voltages.

A photoelectric conversion apparatus according to a first embodiment isformed on a first semiconductor substrate 1 as illustrated in FIG. 1 .This photoelectric conversion apparatus includes a sensor unit 10, acircuit unit 20, a first terminal 30, and a second terminal 31.

The first terminal 30 serves as a terminal for high voltage power (avoltage VDD1) that is supplied to a photodiode disposed in the sensorunit 10. The first terminal 30 is connected to the sensor unit 10 via aline 32.

The second terminal 31 serves as a terminal for low voltage power (avoltage VDD2) that is supplied to a pixel circuit disposed in the sensorunit 10 and to the circuit unit 20. The second terminal 31 is connectedto the sensor unit 10 and the circuit unit 20 via a line 33.

The sensor unit 10 includes a plurality of unit pixels 11. Each of theunit pixels 11 outputs a signal in response to incidence of light. Theplurality of unit pixels 11 is arranged in a matrix in the sensor unit10. FIG. 1 illustrates a case where the unit pixels 11 indicated by P00to P55 in six rows and six columns are arrayed in the sensor unit 10.

The circuit unit 20 includes a vertical selection circuit 21 that drivesthe unit pixel 11, and a signal processing circuit 22 that processes asignal output from the unit pixel 11. The circuit unit 20 furtherincludes a horizontal selection circuit 23 for reading out a signal fromthe signal processing circuit 22, and a control circuit 24 that controlsthe operation of each circuit. FIG. 1 illustrates a signal line PVSELfor supplying a signal from the vertical selection circuit 21, an outputsignal line POUT for outputting a signal from each of the unit pixels11, and a signal line PHSEL for supplying a signal from the horizontalselection circuit 23. Further, FIG. 1 illustrates a signal output lineSOUT from the signal processing circuit 22.

The signal processing circuits 22 are provided in such a manner thateach of the signal processing circuits 22 corresponds to a different oneof columns formed of the plurality of unit pixels 11. The signalprocessing circuit 22 has a function of holding a signal output from theunit pixel 11. A plurality of output signal lines (an n-number of outputsignal lines in FIG. 1 ) is connected to the unit pixels 11 of onecolumn. With such a configuration, each of the signal processingcircuits 22 corresponding to a different one of columns can hold aplurality of signals output from one unit pixel.

(Configuration of Unit Pixel 11)

A specific configuration example of the unit pixel 11 will be describedwith reference to FIG. 2 .

FIG. 2 is a diagram illustrating an equivalent circuit of aconfiguration example of the unit pixel 11. In FIG. 2 , the unit pixel11 includes a diode 12 of avalanche amplification type, P-channel metaloxide semiconductor (PMOS) transistors 13 a to 13 c, N-channel metaloxide semiconductor (NMOS) transistors 14 a to 14 d, and a countercircuit 15.

A reverse bias of a magnitude greater than or equal to a breakdownvoltage is applied to the diode 12, and the diode 12 is set to operatein a Geiger mode. Specifically, a voltage VBIAS (a first power supplyvoltage) is applied from a power supply line 2020 to the anode side ofthe diode 12, and the voltage VDD1 (a second power supply voltage) isapplied from a power supply line 2000 to the cathode side. The voltagedifference between the voltage VBIAS and the voltage VDD1 is greaterthan or equal to the breakdown voltage. For example, the first powersupply voltage is higher than the second power supply voltage, and thefirst power supply voltage is −20 V and the second power supply voltageis 3.3 V.

The PMOS transistor 13 a is a quench element, and forms a predeterminedquenching resistance based on a voltage VQNC. When a photon is incidenton the diode 12, a plurality of electrons (and holes) is generated by anavalanche phenomenon. An electric current generated by the avalanchephenomenon flows through the quench element 13 a, thereby causing avoltage drop. This causes the operational area of the diode 12 to falloutside the Geiger mode. The avalanche phenomenon of the diode 12 isthus stopped, and the voltage restores from the drop caused by thequench element 13 a, so that the operational area of the diode 12 isrestored to the Geiger mode.

The PMOS transistor 13 b and the NMOS transistor 14 a form an invertercircuit 16 to inversely amplify a change in the potential of the cathodeof the diode 12. Because of the inverter circuit 16, the unit pixel 11can shape a pulse signal indicating the presence or absence of photonincidence. Therefore, the inverter circuit may also be referred to asthe “pulse shaping circuit”.

The PMOS transistor 13 c and the NMOS transistor 14 b form an invertercircuit 17 to output an inversion signal (pulse signal) of an output ofthe inverter circuit 16 to the counter circuit 15.

The counter circuit 15 counts the number of pulses output from theinverter circuit 17 and outputs a cumulative counting result to theoutput signal line POUT via the switch of the NMOS transistors 14 c and14 d.

The ON/OFF control in the NMOS transistors 14 c and 14 d is executed inthe signal line PVSEL. FIG. 2 illustrates a case where a 2-bit counteris provided, as an example.

The source of the PMOS transistor 13 a as well as the substrate and thesource of the PMOS transistor 13 b are connected to the power supplyline 2000 so that the PMOS transistors 13 a and 13 b are supplied withthe voltage VDD1. The counter circuit 15 is connected to a power supplyline 2010 so that the counter circuit 15 is supplied with the voltageVDD2.

Here, from the viewpoint of the Geiger mode operation of the diode 12described above, the voltage VDD1 (the second power supply voltage) tobe applied to the quench element 13 a needs a high voltage. For example,as described above, in a case where the voltage VBIAS (the first powersupply voltage) to be supplied to the power supply line 2020 is −20 V,the voltage VDD1 (the second power supply voltage) needs to be 3.3 V.Further, the voltage to be supplied to the inverter circuit 16 alsoneeds to coincide with the amplitude of an analog signal from the quenchelement 13 a. The PMOS transistor 13 a serving as the quench element isin the ON state based on the voltage VQNC. Therefore, in a case wherethere is no photon incidence, the potential of the cathode terminal ofthe diode 12 is VDD1. A large current flows through the PMOS transistor13 a, when the avalanche phenomenon of the diode 12 occurs due to thephoton incidence. At such a moment, as for the potential of the cathodeterminal of the diode 12, although a voltage drop occurs, the amplitudethereof also greatly varies depending on the characteristics of thediode 12 and the PMOS transistor 13 a. Therefore, in order for theinverter circuit 16 to shape reliably the pulse signal into a signalindicating the presence or absence of the photon incidence, the voltageto be supplied to the inverter circuit 16 needs to be a high voltage.According to the present embodiment, the voltage to be supplied to theinverter circuit 16 is to be supplied from the power supply line 2000,so that the voltage VDD1 is applied to the inverter circuit 16. Forexample, the voltage VDD1 is 3.3 V and a voltage VSS of a power supplyline 2030 is 0 V.

Meanwhile, considering the number of elements for configuring a circuitand its operating speed, a transistor more miniaturized than transistorsfor configuring the quench element 13 a and the inverter circuit 16,i.e., a transistor to be driven by a low voltage, is used as atransistor for configuring the counter circuit 15. Specifically, thecounter circuit 15 is supplied with the voltage VSS (a third powersupply voltage) from the power supply line 2030, and supplied with thevoltage VDD2 (a fourth power supply voltage) from the power supply line2010. For this reason, the amplitude of the pulse signal in the countercircuit 15 is the difference between the third power supply voltage andthe fourth power supply voltage. For example, in a case where thevoltage VSS is 0 V and the voltage VDD2 is 1.8 V, the amplitude of thepulse signal is 1.8 V.

In this way, according to the present embodiment, the difference betweenthe first power supply voltage and the second power supply voltage isgreater than the difference between the third power supply voltage andthe fourth power supply voltage. The fourth power supply voltage islower than the second power supply voltage.

Meanwhile, the inverter circuit 16 is supplied with the voltage VSS (afifth power supply voltage) from the power supply line 2030 and suppliedwith the voltage VDD1 (a sixth power supply voltage) from the powersupply line 2000. For this reason, the amplitude of the pulse signaloutput from the inverter circuit 16 is the difference between the fifthpower supply voltage and the sixth power supply voltage. For example, ina case where the voltage VSS is 0 V and the voltage VDD1 is 3.3 V, theamplitude of the pulse signal to be output from the inverter circuit 16is 3.3 V.

The amplitude (e.g., 1.8 V) of the pulse signal in the counter circuit15 and the amplitude (e.g., 3.3 V) of the pulse signal to be output fromthe inverter circuit 16 are different values from each other. In a casewhere a transistor that operates at a low voltage is used in a countercircuit to achieve a miniaturized structure and a higher speed, it isdesirable that the amplitudes of the respective pulse signals be asclose to each other as possible, from the viewpoint of withstand voltageand reliability. Thus, according to the present embodiment, a pulsesignal having a first amplitude and output from the inverter circuit 16is converted into a pulse signal having a second amplitude smaller thanthe first amplitude, by providing the inverter circuit 17. Because sucha function is implemented, the inverter circuit 17 may also be referredto as the “pulse conversion circuit”.

As an example, the voltage VSS (a seventh power supply voltage) of thepower supply line 2030 supplied to the inverter circuit 17 is 0 V, andthe voltage VDD2 (an eighth power supply voltage) of the power supplyline 2010 is 1.8 V. In this case, before and after input of the invertercircuit 17, the amplitude of a pulse signal is converted from 3.3 V to1.8 V. As described above, the amplitude of the pulse signal in thecounter circuit 15 is, for example, 1.8 V, and therefore, an appropriatevalue is set for the amplitude of the pulse signal to be input to thecounter circuit 15, by providing the inverter circuit 17.

(Modification of Pulse Shaping Circuit)

FIG. 3 illustrates another configuration example of the pulse shapingcircuit (the inverter circuit 16) and the pulse conversion circuit (theinverter circuit 17) described above.

The pulse shaping circuit 16 illustrated in FIG. 3 includes PMOStransistors 13 d to 13 f, and NMOS transistors 14 f and 14 g. The PMOStransistor 13 e and the NMOS transistor 14 f are provided to form aninverter. The drain of the PMOS transistor 13 d and the source of thePMOS transistor 13 f are connected to the source of the PMOS transistor13 e. Further, the source of the PMOS transistor 13 d is connected tothe power supply line 2000, and the drain of the PMOS transistor 13 f isconnected to the power supply line 2030. The PMOS transistors 13 d and13 f control the source potential of the PMOS transistor 13 e via therespective drains based on the respective gate potentials. Similarly,the drain of the NMOS transistor 14 e and the source of the NMOStransistor 14 g are connected to the source of the NMOS transistor 14 f.Further, the source of the NMOS transistor 14 e is connected to thepower supply line 2030, and the drain of the NMOS transistor 14 g isconnected to the power supply line 2000. The NMOS transistors 14 e and14 g control the source potential of the NMOS transistor 14 f via therespective drains based on the respective gate potentials. Therefore,the pulse shaping circuit 16 forms a Schmitt trigger circuit in which anoutput state changes while having hysteresis, in response to a change ininput potential.

The pulse conversion circuit 17 is an inverter circuit including thePMOS transistor 13 g and the NMOS transistor 14 h, and converts a highlevel of an output pulse from the voltage VDD1 to the voltage VDD2.

As illustrated in FIG. 3 , providing the pulse shaping circuit 16 as theSchmitt trigger circuit produces such an advantage that it is easy toadjust a threshold in converting the output signal of the diode 12 intoa pulse.

(Cross-Sectional Diagram)

FIG. 4 is a cross-sectional diagram of the photoelectric conversionapparatus according to the present embodiment.

A first chip 101 has a first substrate 104. The first substrate 104 is,for example, a silicon substrate. In the first substrate 104, a surfacewhere a wiring layer is formed is a main surface 105 and another surfaceof the first substrate 104 opposite to the main surface 105 is a backsurface 106. A multilayer wiring structure 107 that includes a firstwiring layer 121 and a second wiring layer 122 is provided on the mainsurface 105 of the first substrate 104 in the first chip 101. Here, forexample, a plug made of tungsten establishes connection, such asconnection between the wiring of the first wiring layer 121 and thewiring of the second wiring layer 122, and connection between a gateelectrode and the wiring of the first wiring layer.

The first substrate 104 is provided with, for example, a well 110 ofP-type, and an active region and a non-active region (a field region)are isolated from each other by an element isolation region 113.

An N-type region 111 and a P-type region 112 included in the diode 12are provided in the well 110. When light is incident on the diode 12, aplurality of electrons is generated by the avalanche phenomenon and thenread out via the N-type region 111.

A PMOS transistor (a first PMOS transistor) is provided in the well 110.This PMOS transistor has a gate 116 a, a source-drain region 115 a, andan N-type well region 114 a. The first PMOS transistor is a transistorthat uses the voltage VDD1. For example, the first PMOS transistor iseach of the PMOS transistors 13 a and 13 b.

Further, a PMOS transistor (a second PMOS transistor) is provided in thewell 110. This PMOS transistor has a gate 116 b, a source-drain region115 b, and an N-type well region 114 b. The second PMOS transistor usesthe voltage VDD2. For example, the second PMOS transistor is the PMOStransistor 13 c.

In the first substrate 104, a well region 118 of P-type is provided inthe well 110. A PMOS transistor (a third PMOS transistor) is provided inthe well region 118. This PMOS transistor has a gate 116 c, asource-drain region 115 c, and an N-type well region 114 c. In otherwords, the third PMOS transistor is a transistor formed in a welldifferent from those of the first and second PMOS transistors. The thirdPMOS transistor uses the voltage VDD2. For example, the third PMOStransistor is a PMOS transistor included in the counter circuit 15.

The line 32 which is a first line for supplying the voltage VDD1 iselectrically connected to the source-drain region 115 a of the firstPMOS transistor, via the wiring of each wiring layer. Further, a firstterminal (a first PAD) 30 is electrically connected to the first line32, and the first line 32 is supplied with the voltage VDD1 from theoutside of the chip, via the first terminal 30.

The line 33 which is a second line for supplying the voltage VDD2 iselectrically connected to the source-drain region 115 b of the secondPMOS transistor and the source-drain region 115 c of the third PMOStransistor, via the wiring of each wiring layer. A second terminal (asecond PAD) 31 is electrically connected to the second line 33, and thesecond line 33 is supplied with the voltage VDD2 from the outside of thechip, via the second terminal 31.

A color filter layer 130 is provided on the multilayer wiring structure107, and a microlens 131 is provided on the color filter layer 130.

Each member illustrated in FIG. 4 is a schematic representation, and theN-type region 111 and the P-type region 112 included in the diode 12 maybe configured to have a wider area. Further, according to the presentembodiment, the inverter circuits 16 and 17 are provided to each diode.For this reason, as illustrated in FIG. 4 , the microlens 131 isprovided to correspond to the diode 12, and the microlens 131 isprovided to correspond also to the transistors forming the invertercircuits 16 and 17. In this case, the microlens 131 is provided tooverlap the transistors forming the inverter circuits 16 and 17.

(Modification)

In the above-described example, the value of the difference between thethird power supply voltage and the fourth power supply voltage isequalized to the value of the difference between the seventh powersupply voltage and the eighth power supply voltage. In other words, theamplitude of the pulse signal of the counter circuit 15 and theamplitude of the pulse signal of the output from the inverter circuit 17are equalized. However, this is not an essential requirement, because anissue that is to be solved is a difference between the amplitude of thepulse signal output from the inverter circuit 16 and the amplitude ofthe pulse signal of the counter circuit 15, and the present embodimentis to reduce the difference. In other words, the value of each powersupply voltage can be appropriately set, as long as the value satisfiesa condition that is (the difference between the fifth power supplyvoltage and the sixth power supply voltage)>(the difference between theseventh power supply voltage and the eighth power supply voltage)>(thedifference between the third power supply voltage and the fourth powersupply voltage). This can also be considered as (the difference betweenthe power supply voltages supplied to the pulse shaping circuit)>(thedifference between the power supply voltages supplied to the pulseconversion circuit)>(the difference between the power supply voltagessupplied to the signal processing circuit). In other words, as for thefifth to eighth power supply voltages, the difference between theseventh power supply voltage and the eighth power supply voltage may begreater than or equal to the difference between the third power supplyvoltage and the fourth power supply voltage.

From a different viewpoint, it may be said that the issue that isaddressed by the present embodiment can be also solved if the value ofthe amplitude of the pulse signal output from the inverter circuit 16 isreduced by the inverter circuit 17. In this case, the value of eachpower supply voltage can be appropriately set, as long as the valuesatisfies a condition that is (the difference between the fifth powersupply voltage and the sixth power supply voltage)>(the differencebetween the seventh power supply voltage and the eighth power supplyvoltage).

Further, each of the first power supply voltage to the eighth powersupply voltage may have a different value. However, if the second powersupply voltage and the sixth power supply voltage have the same value asin the configuration according to the present embodiment, a power supplyline can be shared, and therefore, a device structure can be simplified.Similarly, a power supply line can be shared in such a manner that thethird power supply voltage, the fifth power supply voltage, and theseventh power supply voltage are set to the same value. Similarly, apower supply line can be shared in such a manner that the fourth powersupply voltage and the eighth power supply voltage are set to the samevalue.

A second embodiment is different from the first embodiment in that afirst chip and a second chip are layered.

FIG. 5 is a schematic structural diagram of a photoelectric conversionapparatus according to the present embodiment. A first chip 101 isprovided with a sensor unit 10, and a second chip 201 is provided with acircuit unit 20. The first chip 101 and the second chip 201 are layered.From a first terminal 30, a voltage VDD1 is supplied to the sensor unit10 via a first line 32. From a second terminal 31, a voltage VDD2 issupplied to the sensor unit 10 via a second line 33. A first connectingportion 34 of the first chip 101 and a second connecting portion 35 ofthe second chip 201 are electrically connected in such a that thevoltage VDD2 is to be supplied also to the circuit unit 20, via thesecond line 33, the first connecting portion 34, and the secondconnecting portion 35.

FIG. 6 is a schematic structural diagram of the sensor unit 10 providedin the first chip 101. A plurality of unit pixels 11 is arranged in amatrix, and the voltage VDD1 is supplied to each of the unit pixels 11.FIG. 6 illustrates a case where the unit pixels 11 indicated by P00 toP55 in six rows and six columns are arrayed in the sensor unit 10, andthe pixels P00 to P55 each have at least a diode 12.

FIG. 7 is a schematic structural diagram of the circuit unit 20 providedin the second chip 201. The plurality of unit pixels 11 is arranged in amatrix, and the voltage VDD2 is supplied to each of the unit pixels 11.FIG. 7 illustrates a case where the unit pixels 11 indicated by C00 toC55 in six rows and six columns are arrayed in the circuit unit 20, andthe pixels C00 to C55 each have at least a circuit that processes asignal output from the diode 12.

FIG. 8 is an equivalent circuit diagram illustrating a configurationexample of the unit pixel 11. FIG. 8 is different from FIG. 2 describedin the first embodiment, in that inverter circuits 16 and 17 areprovided in the first chip 101, and a counter circuit 15 is provided inthe second chip 201. According to the present embodiment, for thepurpose of achieving a miniaturized structure, a plurality oftransistors included in the counter circuit 15 has a gate oxide filmreduced in thickness. Meanwhile, the inverter circuit 17 is suppliedwith the voltage VDD1 and the voltage VDD2, to function as a pulseconversion unit. Considering that a high level of a pulse to be input tothe inverter circuit 17 is the voltage VDD1, a transistor included inthe inverter circuit 17 has a gate oxide film that is thick to someextent to secure a withstand voltage. For this reason, if the invertercircuit 17 is provided in the second chip 201, transistors that have thegate oxide films of different thicknesses are mixed in the second chip201. This complicates a process in manufacturing the second chip 201.Therefore, according to the present embodiment, the inverter circuit 17to be the pulse conversion unit is provided in the first chip 101, notin the second chip 201.

FIG. 9 is a cross-sectional diagram of the photoelectric conversionapparatus according to the present embodiment. The present embodiment isdifferent from the first embodiment illustrated in FIG. 4 , in that amicrolens 131 is provided on a back surface 106 of a first substrate104, instead of being provided on a main surface 105 of the firstsubstrate 104. Further, the first chip 101 and the second chip 201 arejoined via a joint plane 100.

The second chip 201 has a second substrate 204. The second substrate 204has a main surface 205 and a back surface 206. An active region and anon-active region are isolated from each other by an element isolationregion 213. A well 220 is formed in the second substrate 204, and aplurality of transistors each having a gate 216, a source-drain region215, and a well region 214 (217) is formed. In FIG. 9 , for example, atransistor having the well region 214 of N type is a PMOS transistor,and a transistor having the well region 217 of P type is an NMOStransistor. In this way, the plurality of transistors including the NMOStransistor and the PMOS transistor is appropriately disposed in thesecond substrate 204.

The wiring of a second wiring layer 122 that is the uppermost layer of amultilayer wiring structure 107 and the wiring of a second wiring layer222 that is the uppermost layer of a multilayer wiring structure 207 arein contact with each other at the joint plane 100, whereby electricconnection is secured.

The first terminal 30 is for supplying the voltage VDD1 to be suppliedto a photodiode disposed in the sensor unit 10 of the first chip. Thefirst terminal 30 is connected to the sensor unit 10 via the line 32.Further, the second terminal 31 is a terminal for supplying the voltageVDD2 to be supplied to both of the sensor unit 10 of the first chip andthe circuit unit 20 of the second chip.

According to the present embodiment, the line 33 passes through thejoint plane 100 between the first chip and the second chip to supply thevoltage VDD2 to both of the chips. Further, the line 33 has the firstconnecting portion 34 and the second connecting portion 35, and thefirst connecting portion 34 and the second connecting portion 35 are incontact with each other at the joint plane 100. The number of processesfor forming an opening (a pad opening) for terminal can be reduced byproviding the first terminal 30 and the second terminal 31 only in thefirst chip 101 that is one of the chips. In addition, the process forforming the opening for terminal can be simplified by providing thefirst terminal 30 and the second terminal 31 in the same wiring layer.

A third embodiment is similar to the second embodiment in that a firstchip and a second chip are layered. However, the third embodiment isdifferent from the second embodiment in that a power supply circuit unitis provided, and a single terminal is provided for connection tooutside.

FIG. 10 is a schematic structural diagram of a photoelectric conversionapparatus according to the present embodiment. A first chip 101 isprovided with a sensor unit 10, and a second chip 201 is provided with acircuit unit 20. The first chip 101 is further provided with a powersupply circuit unit 19. The power supply circuit unit 19 generates avoltage VDD1 and a voltage VDD2, from a voltage supplied from outsidevia a third terminal (a third PAD) 36. The voltage VDD1 generated by thepower supply circuit unit 19 is supplied to the sensor unit 10 via afirst line 32. The voltage VDD2 generated by the power supply circuitunit 19 is supplied to the sensor unit 10 via a second line 33. A firstconnecting portion 34 of the first chip 101 and a second connectingportion 35 of the second chip 201 are electrically connected so that thevoltage VDD2 is supplied also to the circuit unit 20 via the firstconnecting portion 34 and the second connecting portion 35.

FIG. 11 is a cross-sectional diagram of the photoelectric conversionapparatus according to the present embodiment. As for the voltage VDD2to be generated by the power supply circuit unit 19, the line 33 isprovided to pass through a joint plane 100 between the first chip andthe second chip to supply the voltage VDD2 to both of the chips. Theline 33 has the first connecting portion 34 and the second connectingportion 35. The first connecting portion 34 and the second connectingportion 35 are in contact with each other at the joint plane 100.Providing the power supply circuit unit 19 can reduce terminals, andtherefore can reduce the number of processes for forming an opening (apad opening) for a terminal.

A fourth embodiment is similar to the second and third embodiments inthat a first chip and a second chip are layered. However, two terminalsare provided unlike the third embodiment, and the two terminals areprovided in the second chip instead of being provided in the first chip,unlike the second embodiment.

FIG. 12 is a schematic structural diagram of a photoelectric conversionapparatus according to the present embodiment. A first chip 101 isprovided with a sensor unit 10, and a second chip 201 is provided with acircuit unit 20. A fourth terminal (a fourth PAD) 37 is a terminal for avoltage VDD1, and connected to the sensor unit 10 via a line 32, a thirdconnecting portion 39, and a fourth connecting portion 40. A fifthterminal (a fifth PAD) 38 is a terminal for a voltage VDD2, and suppliesthe voltage VDD2 to the circuit unit 20 via a line 33. The fifthterminal 38 supplies the voltage VDD2 also to the sensor unit 10, viathe line 33, a fifth connecting portion 41, and a sixth connectingportion 42.

FIG. 13 is a cross-sectional diagram of the photoelectric conversionapparatus according to the present embodiment. The fourth terminal 37and the fifth terminal 38 are both provided in the second chip 201, andprovided in the same wiring layer. According to the present embodiment,the line 33 for supplying the voltage VDD2 is provided in the first chipand the second chip, and passes through a joint plane 100 between thefirst chip and the second chip to supply the voltage VDD2 to both of thechips. The line 33 has the fifth connecting portion 41 and the sixthconnecting portion 42, and the fifth connecting portion 41 and the sixthconnecting portion 42 are in contact with each other at the joint plane100. Further, according to the present embodiment, the line 32 forsupplying the voltage VDD1 is provided in both of the chips, and theline 32 thus passes through the joint plane 100. The line 32 has thethird connecting portion 39 and the fourth connecting portion 40, andthe third connecting portion 39 and the fourth connecting portion 40 arein contact with each other at the joint plane 100.

The number of processes for forming an opening (a pad opening) for aterminal can be reduced by providing both of the fourth terminal 37 andthe fifth terminal 38 in the second chip that is one of the chips. Inaddition, the process for forming the opening for a terminal can besimplified by providing the fourth terminal 37 and the fifth terminal 38in the same wiring layer.

According to the present embodiment, the line for supplying the voltageVDD1 (the second power supply voltage) and the line for supplying thevoltage VDD2 (the fourth power supply voltage) are both disposed to passthrough the joint plane between the first chip and the second abovechip. However, according to an embodiment of the present invention, asexemplified by the second and third embodiments, at least one of theline for supplying the second power supply voltage and the line forsupplying the fourth power supply voltage may be disposed to passthrough the joint plane.

An imaging system according to a fifth embodiment of the presentinvention will be described with reference to FIG. 14 . FIG. 14 is ablock diagram illustrating a schematic configuration of the imagingsystem according to the present embodiment.

The photoelectric conversion apparatus described above in each of thefirst to fourth embodiments is applicable to various imaging systems.The imaging system to which the photoelectric conversion apparatus isapplicable is not limited in particular. Examples of such an imagingsystem include various apparatuses, such as a digital still camera, adigital camcorder, a surveillance camera, a copier, a facsimile, amobile phone, an on-vehicle camera, an observation satellite, and amedical camera. A camera module including an optical system, such as alens, and a photoelectric conversion apparatus is also included in theexamples of the imaging system. FIG. 14 illustrates a block diagram of adigital still camera provided as an example of these apparatuses.

An imaging system 500 includes a photoelectric conversion apparatus1000, an imaging optical system 502, a central processing unit (CPU)510, a lens control unit 512, an imaging apparatus control unit 514, animage processing unit 516, a diaphragm shutter control unit 518, adisplay unit 520, an operation switch 522, and a storage medium 524.

The imaging optical system 502 is an optical system for forming anoptical image of an object, and includes a lens group and a diaphragm504. The diaphragm 504 has a function of adjusting a light amount inimage capturing by adjusting the aperture diameter thereof. Thediaphragm 504 also has a function of serving as an exposure-timeadjustment shutter in still-image capturing. The lens group and thediaphragm 504 are held to be capable of proceeding and retreating alongan optical axis direction. Interlocking operation of these componentsimplements a magnification varying function (a zoom function) and afocal-point adjustment function. The imaging optical system 502 may beintegrated with the imaging system, or may be an imaging lens that canbe attached to the imaging system.

The photoelectric conversion apparatus 1000 is disposed in such a mannerthat the imaging plane of the photoelectric conversion apparatus 1000 ispositioned in an image space of the imaging optical system 502. Thephotoelectric conversion apparatus 1000 is the photoelectric conversionapparatus described in each of the first to fourth embodiments. Thephotoelectric conversion apparatus 1000 photoelectrically converts anobject image formed by the imaging optical system 502, and outputs theresult as an image signal or a focus detection signal.

The lens control unit 512 controls driving in proceeding and retractionof the lens group of the imaging optical system 502 to perform avariable power operation and a focal point adjustment. The lens controlunit 512 includes a circuit or processor configured to implement such afunction. The diaphragm shutter control unit 518 changes the aperturediameter of the diaphragm 504 (an aperture value is variable) to adjustan image-capturing light amount. The diaphragm shutter control unit 518includes a circuit or processor configured to implement such a function.

The CPU 510 is a controller provided inside a camera and performingvarious kinds of control of a camera body. The CPU 510 includes anarithmetic unit, a read only memory (ROM), a random access memory (RAM),an analog-to-digital (A/D) converter, a digital-to-analog (D/A)converter, and a communication interface circuit. The CPU 510 controlsthe operation of each unit inside the camera based on a computer programstored in a memory, such as the ROM, to execute a series ofimage-capturing operation processes, including autofocus (AF), imaging,image processing, and recording. The CPU 510 also serves as a signalprocessing unit.

The imaging apparatus control unit 514 controls the operation of thephotoelectric conversion apparatus 1000. The imaging apparatus controlunit 514 also performs A/D conversion of a signal output from thephotoelectric conversion apparatus 1000 and transmits a resultant signalto the CPU 510. The imaging apparatus control unit 514 includes acircuit or processor configured to implement those functions. The A/Dconversion function may be included in the photoelectric conversionapparatus 1000. The image processing unit 516 generates an image signalby performing image processing, such as γ-conversion and colorinterpolation, on the signal subjected to the A/D conversion. The imageprocessing unit 516 includes a circuit or controller configured toimplement such a function. The display unit 520 displays informationabout an image-capturing mode of the camera, a preview image beforeimage capturing, an image for checking after image capturing, and afocusing state in focus detection. The operation switch 522 includesswitches, such as a power switch, a release (an image-capturing trigger)switch, a zoom operation switch, and an image-capturing mode selectionswitch. The storage medium 524 stores an image, such as a capturedimage. The storage medium 524 may be built in the imaging system or maybe a removable medium, such as a memory card.

In this way, the imaging system 500 to which the photoelectricconversion apparatus 1000 according to each of the first to fourthembodiments is applied is configured. A high-performance imaging systemcan be thereby implemented.

An imaging system and a moving body according to a sixth embodiment ofthe present invention will be described with reference to FIGS. 15A and15B. FIGS. 15A and 15B illustrate a configuration of the imaging systemand a configuration of the moving body, respectively, according to thepresent embodiment.

FIG. 15A illustrates an example of an imaging system 400 related to anon-vehicle camera. The imaging system 400 has a photoelectric conversionapparatus 410. The photoelectric conversion apparatus 410 is thephotoelectric conversion apparatus according to any one of theabove-described first to fourth embodiments. The imaging system 400 hasan image processing unit 412. The image processing unit 412 is aprocessor that performs image processing, for a plurality of pieces ofimage data acquired by the photoelectric conversion apparatus 410. Theimaging system 400 further has a parallax acquisition unit 414. Theparallax acquisition unit 414 is a processor that calculates a parallax,from the plurality of pieces of image data acquired by the photoelectricconversion apparatus 410. The imaging system 400 further has a distanceacquisition unit 416 and a collision determination unit 418. Thedistance acquisition unit 416 is a processor that calculates a distanceto a target object, based on the calculated parallax. The collisiondetermination unit 418 is a processor that determines whether there is apossibility of collision, based on the calculated distance. Here, theparallax acquisition unit 414 and the distance acquisition unit 416 areprovided as an example of an information acquisition unit that acquiresinformation, such as distance information indicating a distance to atarget object. In other words, the distance information is informationabout a parallax, a de-focusing quantity, and a distance to a targetobject. The collision determination unit 418 may determine a possibilityof collision using any one of these pieces of distance information. Theabove-described various processors may each be implemented by hardwaredesigned for a special purpose, or may be implemented by general-purposehardware that performs an arithmetic operation based on a softwaremodule. The processors may each be implemented by a device, such as afield programmable gate array (FPGA) or an application specificintegrated circuit (ASIC), or may be implemented by a combination ofthese devices.

The imaging system 400 is connected to a vehicle information acquisitionapparatus 420, and can acquire vehicle information, such as a vehiclespeed, a yaw rate, and a rudder angle. Further, a control electroniccontrol unit (ECU) 430 is connected to the imaging system 400. Thecontrol ECU 430 is a controller that outputs a control signal forgenerating a braking force for a vehicle, based on a result ofdetermination by the collision determination unit 418. In other words,the control ECU 430 is an example of a moving body control unit thatcontrols a moving body based on distance information. The imaging system400 is also connected to an alarm apparatus 440 that gives an alarm to adriver, based on a result of determination by the collisiondetermination unit 418. For example, in a case where the result ofdetermination by the collision determination unit 418 indicates a highpossibility of collision, the control ECU 430 performs vehicle controlfor avoiding collision or reducing damage by, for example, braking,releasing an accelerator, or suppressing an engine output. The alarmapparatus 440 gives a warning to a user by, for example, generating anaudible alarm, displaying alarm information on a screen of a carnavigation system, or vibrating a seatbelt or steering.

In the present embodiment, the imaging system 400 images an area aroundthe vehicle, e.g., the front or the rear. FIG. 15B illustrates theimaging system 400 in a case where the front (an imaging area 450) ofthe vehicle is imaged. The vehicle information acquisition apparatus 420sends an instruction for causing the imaging system 400 to performimaging. Using the photoelectric conversion apparatus according to anyone of the above-described first to fourth embodiments, as thephotoelectric conversion apparatus 410, the imaging system 400 accordingto the present embodiment can further enhance the accuracy of ranging.

The example in which the control for not colliding with other vehicle isperformed is described above. However, the imaging system is alsoapplicable to control, for example, automatic driving control forfollowing other vehicle and automatic driving control for not deviatingfrom a lane. Further, the imaging system is applicable to not only avehicle, such as an automobile, but also, for example, a moving body (atransport machine) such as a ship, an airplane, or an industrial robot.Examples of a movement apparatus in the moving body (the transportmachine) includes any of various movement units such as an engine, amotor, a wheel, and a propeller. In addition, the imaging system isapplicable to not only the moving body, but also an apparatus thatutilizes object recognition in a wide range, such as an intelligenttransport system (ITS).

Each of the above-described embodiments is only a specific example inimplementing the present invention, and interpretation of the technicalscope of the present invention is not restricted by these embodiments.In other words, the present invention can be implemented in variousforms without deviating from the technical ideas or the substantialcharacteristics thereof.

According to the above-described embodiments of the present invention,it is possible to provide a configuration suitable for a photoelectricconversion apparatus that includes a photoelectric conversion unit foroutputting a digital signal and uses a plurality of power supplyvoltages.

While the present invention has been described with reference toembodiments, it is to be understood that the invention is not limited tothe disclosed embodiments. The scope of the following claims is to beaccorded the broadest interpretation so as to encompass all suchmodifications and equivalent structures and functions.

What is claimed is:
 1. A photoelectric conversion apparatus comprising:a first chip having a diode of avalanche amplification type; and asecond chip having a signal processing circuit that processes a signalbased on an output from the diode, wherein the first chip and the secondchip are layered, one on top of the other, wherein the diode is suppliedwith a first voltage and a second voltage, wherein the signal processingcircuit is supplied with a third voltage and a fourth voltage, wherein adifference between the first voltage and the second voltage is greaterthan a difference between the third voltage and the fourth voltage, andwherein at least one of the second voltage and the fourth voltage issupplied through a joint plane between the first chip and the secondchip.
 2. The photoelectric conversion apparatus according to claim 1,wherein the second voltage is supplied through the joint plane, and thesignal based on an output from the diode is supplied through the jointplane.
 3. The photoelectric conversion apparatus according to claim 1,wherein a line that supplies the first voltage is disposed not to passthrough the joint plane.
 4. The photoelectric conversion apparatusaccording to claim 1, wherein a line that supplies the second voltagedisposed to pass through the joint plane between the first chip and thesecond chip has a first connecting portion provided in the first chipand a second connecting portion provided in the second chip, and thefirst connecting portion and the second connecting portion are arrangedto contact one another at the joint plane, wherein a first portiondisposed adjacent to the first connecting portion and provided on thefirst chip and a second portion disposed adjacent to the secondconnecting portion and provided on the second chip are different inmaterial from both of the first connecting portion and the secondconnecting portion, and wherein the first portion and the second portionare arranged to contact one another at the joint plane.
 5. An imagingsystem comprising: the photoelectric conversion apparatus according toclaim 1; and a processing apparatus configured to process a signaloutput from the photoelectric conversion apparatus.
 6. A moving bodycomprising: the photoelectric conversion apparatus according to claim 1;a movement apparatus; a processing apparatus configured to acquireinformation from a signal output from the photoelectric conversionapparatus; and a control apparatus configured to control the movementapparatus based on the information.
 7. The photoelectric conversionapparatus according to claim 1, wherein the first chip has a firstsemiconductor substrate on which the diode is disposed and a firstwiring layer, wherein the second chip has a second semiconductorsubstrate on which the signal processing circuit is disposed and asecond wiring layer, wherein the first wiring layer and the secondwiring layer are disposed between the first semiconductor substrate andthe second semiconductor substrate, wherein the photoelectric conversionapparatus further comprises a first terminal configured to beconnectable to a power supply outside of the photoelectric conversionapparatus and providing the second voltage, and a second terminalconfigured to be connectable to a power supply outside of thephotoelectric conversion apparatus and providing the fourth voltage, andwherein the first terminal is disposed on either the first wiring layeror the second wiring layer, and the second terminal is disposed oneither the first wiring layer or the second wiring layer.
 8. Thephotoelectric conversion apparatus according to claim 7, wherein a linethat supplies the second voltage disposed to pass through the jointplane between the first chip and the second chip has a first connectingportion provided in the first chip and a second connecting portionprovided in the second chip, and the first connecting portion and thesecond connecting portion are arranged to contact one another at thejoint plane, wherein a first portion disposed adjacent to the firstconnecting portion and provided on the first chip and a second portiondisposed adjacent to the second connecting portion and provided on thesecond chip are different in material from both of the first connectingportion and the second connecting portion, and wherein the first portionand the second portion are arranged to contact one another at the jointplane.
 9. A photoelectric conversion apparatus comprising: a first chiphaving a diode of avalanche amplification type; and a second chip havinga signal processing circuit that processes a signal based on an outputfrom the diode, wherein the first chip and the second chip are layered,one on top of the other, wherein the diode is supplied with a firstvoltage difference, wherein the signal processing circuit is suppliedwith a second voltage difference, wherein the first voltage differenceis greater than the second voltage difference, and wherein at least onevoltage for the first voltage difference and the second voltagedifference is supplied through a joint plane between the first chip andthe second chip.
 10. The photoelectric conversion apparatus according toclaim 9, wherein one voltage for the first voltage difference issupplied through the joint plane, and the signal based on an output fromthe diode is supplied through the joint plane.
 11. The photoelectricconversion apparatus according to claim 10, wherein a line that suppliesone voltage for the first voltage difference disposed to pass throughthe joint plane between the first chip and the second chip has a firstconnecting portion provided in the first chip and a second connectingportion provided in the second chip, and the first connecting portionand the second connecting portion are arranged to contact one another atthe joint plane, wherein a first portion disposed adjacent to the firstconnecting portion and provided on the first chip and a second portiondisposed adjacent to the second connecting portion and provided on thesecond chip are different in material from both of the first connectingportion and the second connecting portion, and wherein the first portionand the second portion are arranged to contact one another at the jointplane.
 12. The photoelectric conversion apparatus according to claim 9,wherein a line that supplies one voltage for the first voltagedifference is disposed not to pass through the joint plane.
 13. Animaging system comprising: the photoelectric conversion apparatusaccording to claim 9; and a processing apparatus configured to process asignal output from the photoelectric conversion apparatus.
 14. A movingbody comprising: the photoelectric conversion apparatus according toclaim 9; a movement apparatus; a processing apparatus configured toacquire information from a signal output from the photoelectricconversion apparatus; and a control apparatus configured to control themovement apparatus based on the information.
 15. The photoelectricconversion apparatus according to claim 9, wherein the first chip has afirst semiconductor substrate on which the diode is disposed and a firstwiring layer, wherein the second chip has a second semiconductorsubstrate on which the signal processing circuit is disposed and asecond wiring layer, wherein the first wiring layer and the secondwiring layer are disposed between the first semiconductor substrate andthe second semiconductor substrate, wherein the photoelectric conversionapparatus further comprises a first terminal configured to beconnectable to a power supply outside of the photoelectric conversionapparatus and providing the second voltage, and a second terminalconfigured to be connectable to a power supply outside of thephotoelectric conversion apparatus and providing the fourth voltage, andwherein the first terminal is disposed on either the first wiring layeror the second wiring layer, and the second terminal is disposed oneither the first wiring layer or the second wiring layer.
 16. Thephotoelectric conversion apparatus according to claim 15, wherein a linethat supplies the second voltage disposed to pass through the jointplane between the first chip and the second chip has a first connectingportion provided in the first chip and a second connecting portionprovided in the second chip, and the first connecting portion and thesecond connecting portion are arranged to contact one another at thejoint plane, wherein a first portion disposed adjacent to the firstconnecting portion and provided on the first chip and a second portiondisposed adjacent to the second connecting portion and provided on thesecond chip are different in material from both of the first connectingportion and the second connecting portion, and wherein the first portionand the second portion are arranged to contact one another at the jointplane.
 17. A photoelectric conversion apparatus comprising: a first chiphaving a diode of avalanche amplification type; and a second chip havinga signal processing circuit that processes a signal based on an outputfrom the diode, wherein the first chip and the second chip are layered,one on top of the other, wherein the diode is supplied with a firstvoltage and a second voltage, wherein the signal processing circuit issupplied with a third voltage and a fourth voltage, wherein a differencebetween the first voltage and the second voltage is greater than adifference between the third voltage and the fourth voltage, and whereinat least one of a line that supplies the second voltage and a line thatsupplies the fourth voltage is disposed to pass through a joint planebetween the first chip and the second chip.
 18. The photoelectricconversion apparatus according to claim 17, wherein the line thatsupplies the second voltage is disposed to pass through a joint planebetween the first chip and the second chip, and wherein an output nodeconnected to the diode is disposed to pass through the joint plane. 19.The photoelectric conversion apparatus according to claim 17, whereinthe first voltage is a voltage on anode side of the diode, and thesecond voltage is a voltage on cathode side of the diode.
 20. Thephotoelectric conversion apparatus according to claim 19, wherein thesecond voltage is higher than the first voltage, and the fourth voltageis higher than the third voltage.
 21. The photoelectric conversionapparatus according to claim 20, further comprising: a first terminalconfigured to be connectable to a power supply outside of thephotoelectric conversion apparatus and providing the second voltage; anda second terminal configured to be connectable to a power supply outsideof the photoelectric conversion apparatus and providing the fourthvoltage, wherein both of the first terminal and the second terminal aredisposed on either the first chip or the second chip.
 22. Thephotoelectric conversion apparatus according to claim 21, wherein thefirst terminal and the second terminal are provided in a same wiringlayer.
 23. The photoelectric conversion apparatus according to claim 20,further comprising a power supply circuit unit configured to generatethe second voltage and the fourth voltage.
 24. The photoelectricconversion apparatus according to claim 17, wherein the line thatsupplies the second voltage disposed to pass through the joint planebetween the first chip and the second chip has a first connectingportion provided in the first chip and a second connecting portionprovided in the second chip, and the first connecting portion and thesecond connecting portion are arranged to contact one another at thejoint plane.
 25. The photoelectric conversion apparatus according toclaim 24, further comprising a first portion disposed adjacent to thefirst connecting portion and provided on the first chip and a secondportion disposed adjacent to the second connecting portion and providedon the second chip, wherein each of the first portion and the secondportion is different in material from both of the first connectingportion and the second connecting portion, and wherein the first portionand the second portion are arranged to contact one another at the jointplane.
 26. The photoelectric conversion apparatus according to claim 17,wherein the signal processing circuit is a counter circuit that countsthe number of pulses.
 27. The photoelectric conversion apparatusaccording to claim 17, wherein a line that supplies the first voltage isdisposed not to pass through the joint plane.
 28. An imaging systemcomprising: the photoelectric conversion apparatus according to claim17; and a processing apparatus configured to process a signal outputfrom the photoelectric conversion apparatus.
 29. A moving bodycomprising: the photoelectric conversion apparatus according to claim17; a movement apparatus; a processing apparatus configured to acquireinformation from a signal output from the photoelectric conversionapparatus; and a control apparatus configured to control the movementapparatus based on the information.
 30. The photoelectric conversionapparatus according to claim 17, wherein the first voltage is a firstpower supply voltage.
 31. The photoelectric conversion apparatusaccording to claim 17, wherein the second voltage is a second powersupply voltage.
 32. The photoelectric conversion apparatus according toclaim 17, wherein the fourth voltage is a fourth power supply voltage.33. The photoelectric conversion apparatus according to claim 17,wherein the first chip has a first semiconductor substrate on which thediode is disposed and a first wiring layer, wherein the second chip hasa second semiconductor substrate on which the signal processing circuitis disposed and a second wiring layer, wherein the first wiring layerand the second wiring layer are disposed between the first semiconductorsubstrate and the second semiconductor substrate, wherein thephotoelectric conversion apparatus further comprises a first terminalconfigured to be connectable to a power supply outside of thephotoelectric conversion apparatus and providing the second voltage, anda second terminal configured to be connectable to a power supply outsideof the photoelectric conversion apparatus and providing the fourthvoltage, and wherein the first terminal is disposed on either the firstwiring layer or the second wiring layer, and the second terminal isdisposed on either the first wiring layer or the second wiring layer.34. The photoelectric conversion apparatus according to claim 33,wherein a line that supplies the second voltage disposed to pass throughthe joint plane between the first chip and the second chip has a firstconnecting portion provided in the first chip and a second connectingportion provided in the second chip, and the first connecting portionand the second connecting portion are arranged to contact one another atthe joint plane, wherein a first portion disposed adjacent to the firstconnecting portion and provided on the first chip and a second portiondisposed adjacent to the second connecting portion and provided on thesecond chip are different in material from both of the first connectingportion and the second connecting portion, and wherein the first portionand the second portion are arranged to contact one another at the jointplane.